Archive for the ‘Japan’ Category

WiMAX continues to gain worldwide momentum

June 13, 2009

wimax logo

WiMAX deployments cover more than 430 million point of presences (POP) worldwide, and are forecast to reach 800 million POPs by the end of 2010, according to WiMAX Forum’s research.

According to data from the WiMAX Forum, there were 468 WiMAX deployments in 139 countries as of March 2009. A year earlier, the number was almost half: only 260 deployments in 110 countries. The WiMAX Forum had certified a total of 82 products by the end of 2008, and expects to certify 180 new products in 2009.

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Japan: Fujitsu develops Mobile WiMAX module for USB dongle

June 13, 2009

fujitsu usb wimax

Fujitsu Microelectronics Ltd has developed a Mobile WiMAX module that can be used to downsize “USB dongle-type” communication devices.

It includes Fujitsu Microelectronics’ baseband processing LSI chip and RF circuit module. With this module, it is possible to realize USB dongles smaller than existing ones. The release date has not been determined yet.

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Japan: NEC exhibits compact WiFi router for Mobile WiMAX

June 13, 2009

nec wifi wimax

NEC Access Technica Ltd has developed a compact router featuring Mobile WiMAX and wirelss LAN capabilities and exhibited it at Interop Tokyo 2009, an exhibition taking place in Makuhari Messe in Chiba Prefecture, Japan.

The router can create a wireless LAN network anywhere in the area of Mobile WiMAX. Equipped with a Li-ion secondary battery, it can be used outdoors too.

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Japan: Mazda Axela (Mazda 3) to get HDD navigation

June 11, 2009

mazda 3

Mazda has released specifications of the new Mazda Axela (sold as Mazda 3 outside Japan). A 40-gigabyte HDD navigation system with a seven-inch display is available for all model grades as a factory-installed set option.

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Infineon: System-on-Chip platforms

June 10, 2009

infineon logo

The quest for wireless communications has seen healthy growth in the last few years. Despite economic uncertainty in these turbulent times, demand for communication devices remains strong, especially for products that are priced competitively. To meet the ever increasing demand from consumers in terms of portability, mobility, low energy consumption and affordability, manufacturers are looking to system-on-chip (SoC) solutions to provide the answers.

This article illustrates how SoC solutions from Infineon address the varying needs of consumers in three different market segments: voice, multimedia and mobile broadband. These solutions enable manufacturers to design and produce low-cost, high-quality wireless handsets with rich feature sets.

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